Manufacturer for Wi-Fi 11ac - ECMM, DOCSIS 3.0, 1xGE, MCX/SMB/MMCX, DV110IE – MoreLink

Manufacturer for Wi-Fi 11ac - ECMM, DOCSIS 3.0, 1xGE, MCX/SMB/MMCX, DV110IE – MoreLink

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Manufacturer for Wi-Fi 11ac - ECMM, DOCSIS 3.0, 1xGE, MCX/SMB/MMCX, DV110IE – MoreLink Detail:

Product Detail

The MoreLink’s DV110IE is a DOCSIS 3.0 ECMM Module (Embedded Cable Modem Module) supporting up to 8 downstream and 4 upstream bonded channels to deliver a powerful high-speed Internet experience.

The DV110IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.

Base on Full Band Capture (FBC) function, DV110IE is not only a Cable Modem, but also can be used as a Spectrum Analyzer.

Heatsink is mandatory and application specific. Three PCB holes are provided around the CPU, so that a heatsinking bracket or similar device can be affixed to the PCB, to transfer the generated heat away from the CPU and towards the housing and environment.

This product specification covers DOCSIS® and EuroDOCSIS® 3.0 versions of the Embedded Cable Modem Module series of products. Throughput this document, it will be referred as DV110IE.

The DV110IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.

Base on Full Band Capture (FBC) function, DV110IE is not only a Cable Modem, but also can be used as a Spectrum Analyzer.

Product Features

➢ DOCSIS / EuroDOCSIS 3.0 compliant

➢ 8 downstream x 4 upstream bonded channels

➢ Temperature hardened

➢ Support Full Band Capture

➢ RF Connector: SMB for combined DS and US

➢ RF Connector: MMCX for separate DS and US

➢ SPI, UART, GPIO signals are accessible by Signal Interface

➢ One Gigabit Ethernet Port supporting auto-negotiation

➢ Standalone External Watchdog (Optional)

➢ Temperature sensor on board (Optional)

➢ Accurate RF power level (+/-1dB) at all temperature range

➢ Embedded Spectrum Analyzer

➢ DOCSIS MIBs, SCTE HMS MIBs supported

➢ Open system API and data structure for 3rd party application access

➢ Software upgrade by HFC network

➢ Small Package Size of PCBA

The DV110IE is a core module having a very small foot print and easily integrated in other HFC products. The system block as below:

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External Watchdog

An external watchdog is used to make sure the system’s operation reliably. Watchdog is kicked by the Firmware every once in a while so that the CM does not reset. If there’s something wrong with the CM Firmware, then after a certain period (watchdog time), the CM will reset automatically.

1

Application

➢ Transponder, such as Power Supply, Fiber Node, UPS, CATV Power

➢ IP-Camera Video

➢ Digital Signage

➢ Wi-Fi Hotspot Traffic

➢ Emergency broadcast

➢ 4G LTE and 5G Small Cell

➢ DVB-C or Hybrid STB embedded CM

➢ Smart City Applications

➢ CATV/QAM/DOCSIS/HFC Instruments and Apparatuses

Support HMS MIBs

1

SCTE 36(HMS028R6) SCTE-ROOT and scteHmsTree definition

2

SCTE 37(HMS072R5) scteHmsTree subgroups

3

SCTE 38-1(HMS026R12) propertyIdent objects

4

SCTE 38-2(HMS023R13) alarmsIdent objects

5

SCTE 38-3(HMS024R13) commonAdminGroup objects and the commonPhyAddress object

6

SCTE 38-4(HMS027R12) psIdent objects

7

SCTE 38-5(HMS025R13) fnIdent objects

8

SCTE 38-7(HMS050R5) transponderInterfaceBusIdent objects

9

SCTE 38-10(HMS115) RF Amplifier MIB objects

10

SCTE 25-1 Hybrid Fiber Coax Outside Plant Status Monitoring

Spectrum Analyzer: Main Features

- Scan frequency range (5 – 1002 MHz)

- RBW setting

- Marker (When Locked, Power Level/ QAM/ post BER / pre BER/ Symbol Rate)

- Constellation

- Peak/ Average

- Alert

- Unit (dBm/ dBmV/ dBuV)

- Nosie level <-50 dBmV for DS

- Noise level <-20 dBmV for US

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Technical Parameters

Protocol Support

DOCSIS/EuroDOCSIS 1.1/2.0/3.0
SNMP v1/v2/v3
TR069

CPU and Memory

CPU BCM33838M (8×4, Commercial, 0 ~ +70 oC)
BCM3383DI (8×4, Industrial, -40 ~ +85 oC) (Optional)
BCM334843D (16×4, Commercial, 0 ~ +70 oC) (Optional)
Memory 128MB DDR3
Flash 16MB SPI Flash

Connectivity

RF x1 SMB Connector for combined D/S and U/S (J1405)
x2 MMCX Connectors for separate D/S (J1415) and U/S (J1416)
RJ45 1x RJ45 Ethernet port 10/100/1000 Mbps (J401)
Signal Interface Pin Header, 2×10, 2.0mm, Right Angle (Option) (J1410)
Box Header, 2×10, 2.0mm, Straight Angle (Option) (J1413)
Pin Header, 2×10, 2.0mm, Straight Angle, Male (J1414)
Pin Definitions see Table #1

RF Downstream

Frequency (edge-to-edge) 88~1002 MHz (DOCSIS)
108~1002MHz (EuroDOCSIS)
Channel Bandwidth 6MHz (DOCSIS)
8MHz (EuroDOCSIS)
6/8MHz (Auto Detection, Hybrid Mode)
Modulation 64QAM, 256QAM
Data Rate Up to 400Mbps by 8 Channel bonding
Signal Level Docsis: -15 to +15dBmV
Euro Docsis: -17 to +13dBmV (64QAM); -13 to +17dBmV (256QAM)

RF Upstream

 

Frequency Range 5~42MHz (DOCSIS)
5~65MHz (EuroDOCSIS)
5~85MHz (Optional)
Modulation TDMA: QPSK,8QAM,16QAM,32QAM,64QAM
S-CDMA: QPSK,8QAM,16QAM,32QAM,64QAM,128QAM
Data Rate Up to 108Mbps by 4 Channel Bonding
RF Output Level TDMA (32/64 QAM): +17 ~ +57dBmV
TDMA (8/16 QAM):  +17 ~ +58dBmV
TDMA (QPSK):      +17 ~ +61dBmV
S-CDMA:           +17 ~ +56dBmV

Networking

Network protocol IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 and L3)
Routing DNS / DHCP server / RIP I and II
Internet Sharing NAT / NAPT / DHCP server / DNS
SNMP version SNMP v1/v2/v3
DHCP server Built-in DHCP server to distribute IP address to CPE by CM’s Ethernet port
DCHP client CM automatically gets IP and DNS server address from MSO DHCP server

Mechanical

Status LED x6 (PWR, DS, US, Online, LAN, RF Levels)
Factory Reset Button x1 (SW401)
Dimensions 65mm (W) x 110mm (H) x 17mm (D)

Environmental

Power Input DC Jack (6.4mm/2.0mm) (CN6)
Wafer Header, 1x 2, 2.0mm, Right Angle. (Option) (CN5)
Support wide power input: +5VDC ~ +24VDC
Power Consumption 12W (Max.) 7W (TYP.)
Operating Temperature Commercial: 0 ~ +70 oC
Industrial: -40 ~ +85 oC
Operating Humidity 10~90% (Non Condensing)
Storage Temperature -40 ~ +85 oC

Signal Interface:  Pin Definition (J1410, J1413, J1414)

Port Pin Signal Description Signal Type Signal Level

1

SPI MOSI Digital Output 0 to 3.3VDC

2

SPI CLOCK Digital Output 0 to 3.3VDC

3

SPI MISO Digital Input 0 to 3.3VDC

4

DS LED (lit when low) Digital Output 0 to 3.3VDC

5

Ground Reference 0V

6

ONLINE LED (lit when low) Digital Output 0 to 3.3VDC

7

US LED (lit when low) Digital Output 0 to 3.3VDC

8

PWR LED (lit when low) Digital Output 0 to 3.3VDC

9

SPI Chip Select 1 Digital Output 0 to 3.3VDC

10

SPI Chip Select 2 Digital Output 0 to 3.3VDC

11

GPIO_01 Future use 0 to 3.3VDC

12

Ground Reference 0V

13

Ground Reference 0V

14

Serial port transmit enable Digital Output 0 to 3.3VDC

15

Reset (Active low) Digital Input 0 to “Open” or 3.3VDC

16

RF LEVEL Green LED (lit when low) Digital Output 0 to 3.3VDC

17

GPIO_02 Future use 0 to 3.3VDC

18

RF LEVEL Red LED (lit when low) Digital Output 0 to 3.3VDC

19

UART Transmit Digital Output 0 to 3.3VDC

20

UART Receive Digital Output 0 to 3.3VDC

J1410: Pin Header, 2×10, 2.0mm, Right Angle. 

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J1413: Box Header, 2×10, 2.0mm, Straight Angle. 

2 (9)

J1414: Pin Header, 2×10, 2.0mm, Straight Angle. 

2 (10)

J401: RJ45, w/o Transformer, w/Two LEDs, w/Shielding, Right Angle

2 (11)

J1417: Wafer Header, 1×8, 2.0mm, Right Angle.

2 (2)
2 (1)
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SW401: Reset Button, SMD, Right Angle. 

2 (12)

J1405: SMB, 75 OHM, DIP, Right Angle. Combined D/S and U/S RF Signal.

2 (13)

J1415, J1416: MMCX, 50 OHM, DIP, Right Angle. Separate D/S and U/S RF Signal.

2 (3)

CN5: Wafer Header, 1x 2, 2.0mm, Right Angle. Populate at the bottom side of PCB.

Pin1 – VIN

Pin2 – GND

2 (14)

CN6: DC JACK, OD=6.4mm/ID=2.0mm. Matching DC Plug OD=5.5mm/ID=2.1mm

2 (5)
2 (15)

Heatsink Dimensions (Unit: mm)

2 (17)

PCBA Dimensions (Unit: mm)

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Product detail pictures:

Manufacturer for Wi-Fi 11ac - ECMM, DOCSIS 3.0, 1xGE, MCX/SMB/MMCX, DV110IE – MoreLink detail pictures

Manufacturer for Wi-Fi 11ac - ECMM, DOCSIS 3.0, 1xGE, MCX/SMB/MMCX, DV110IE – MoreLink detail pictures


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