China Wholesale Watchdog Manufacturers – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink
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China Wholesale Watchdog Manufacturers – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink Detail:
Product Detail
The MoreLink’s SA120IE is a DOCSIS 3.0 ECMM Module (Embedded Cable Modem Module) supporting up to 8 downstream and 4 upstream bonded channels to deliver a powerful high-speed Internet experience.
The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.
Base on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also can be used as a Spectrum Analyzer.
This product specification covers DOCSIS® and EuroDOCSIS® 3.0 versions of the Embedded Cable Modem Module series of products. Throughput this document, it will be referred as SA120IE.The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment. Based on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also it can be used as a Spectrum Analyzer (SSA-Splendidtel Spectrum Analyzer). Heatsink is mandatory and application specific. Three PCB holes are provided around the CPU, so that a heatsinking bracket or similar device can be affixed to the PCB, to transfer the generated heat away from the CPU and towards the housing and environment.
Product Features
➢ DOCSIS / EuroDOCSIS 3.0 compliant
➢ 8 downstream x 4 upstream bonded channels
➢ Support Full Band Capture
➢ Two MCX (Female) connectors for Downstream and Upstream
➢ Two 10/100/1000 Mbps Ethernet Ports
➢ Standalone External Watchdog
➢ Temperature sensor on board
➢ Accurate RF power level (+/-2dB) at all temperature range
➢ Embedded Spectrum Analyzer (Range: 5~1002 MHz)
➢ DOCSIS MIBs, SCTE HMS MIBs supported
➢ Software upgrade by HFC network
➢ Support SNMP V1/V2/V3
➢ Support baseline privacy encryption (BPI/BPI+)
➢ Small size (dimensions): 136mm x 54mm
Application
➢ Transponder: Fiber Node, UPS, Power Supply.
Technical Parameters
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Protocol Support |
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| DOCSIS/EuroDOCSIS 1.1/2.0/3.0 SNMP v1/v2/v3 TR069 |
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CPU and Memory |
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| CPU | BCM33838M (8×4, Commercial, 0 ~ +70 oC) BCM3383DI (8×4, Industrial, -40 ~ +85 oC) |
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| Memory | 64MB DDR3 | |
| Flash | 8MB SPI Flash | |
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Connectivity |
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| RF: MCX1, MCX2 | Two MCX Female, 75 OHM, Straight Angle, DIP | |
| Ethernet Signal/PWR: J1, J2 | 1.27mm 2×17 PCB Stack, Straight Angle, SMD 2xGiga Ethernet Ports |
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RF Downstream |
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| Frequency (edge-to-edge) | 88~1002 MHz (DOCSIS) 108~1002 MHz (EuroDOCSIS) |
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| Channel Bandwidth | 6 MHz (DOCSIS) 8 MHz (EuroDOCSIS) 6/8 MHz (Auto Detection, Hybrid Mode) |
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| Modulation | 64QAM, 256QAM | |
| Data Rate | Up to 400 Mbps by 8 Channel bonding | |
| Signal Level | Docsis: -15 to +15 dBmV Euro Docsis: -17 to +13 dBmV (64QAM); -13 to +17 dBmV (256QAM) |
|
|
RF Upstream |
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| Frequency Range | 5~42 MHz (DOCSIS) 5~65 MHz (EuroDOCSIS) 5~85 MHz (Optional) |
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| Modulation | TDMA: QPSK,8QAM,16QAM,32QAM,64QAM S-CDMA: QPSK,8QAM,16QAM,32QAM,64QAM,128QAM |
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| Data Rate | Up to 108 Mbps by 4 Channel Bonding | |
| RF Output Level | TDMA (32/64 QAM): +17 ~ +57 dBmV TDMA (8/16 QAM): +17 ~ +58 dBmV TDMA (QPSK): +17 ~ +61 dBmV S-CDMA: +17 ~ +56 dBmV |
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Networking |
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| Network protocol | IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 and L3) | |
| Routing | DNS / DHCP server / RIP I and II | |
| Internet Sharing | NAT / NAPT / DHCP server / DNS | |
| SNMP version | SNMP v1/v2/v3 | |
| DHCP server | Built-in DHCP server to distribute IP address to CPE by CM’s Ethernet port | |
| DCHP client | CM automatically gets IP and DNS server address from MSO DHCP server | |
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Mechanical |
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| Dimensions | 56mm (W) x 113mm (L) | |
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Environmental |
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| Power Input | Support wide power input: +12V to +24V DC | |
| Power Consumption | 12W (Max.) 7W (TPY.) |
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| Operating Temperature | Commercial: 0 ~ +70 oC Industrial: -40 ~ +85 oC |
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| Operating Humidity | 10~90% (Non Condensing) | |
| Storage Temperature | -40 ~ +85 oC | |
Board-to-Board Connectors between Digital and CM Board
There’re two boards: Digital board and CM Board, which use four pairs of board-to-board connectors to transmit RF signals, Digital signals and power.
Two pairs of MCX connectors used for DOCSIS Downstream and Upstream RF Signals. Two pairs of Pin Header/PCB Socket used for Digital Signals and Power. CM board is placed under the Digital Board. CM’s CPU is contacted to the housing through thermal pad to transfer the heat away from CPU and towards the housing and environment.
The mated height between two boards is 11.4+/-0.1mm.
Here’s the illustration of matched board-to-board connection:
Note:
Cause of Board-to-Board design for two PCBA Boards, in order to make sure stable and reliable connection, therefore, when
To design the Housing, it should be taken the assembly engineering and screws for fix into consideration.
J1, J2: 2.0mm 2×7 PCB Socket, Straight Angle, SMD
J1: Pin Definition (Preliminary)
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J1 Pin |
CM Board |
Digital Board |
Comments |
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1 |
GND |
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2 |
GND |
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3 |
TR1+ |
Giga Ethernet Signals from CM board. There’s NO Ethernet transformer on the CM board, here’re Only the Ethernet MDI Signals to Digital Board. RJ45 and Ethernet transformer are placed at Digital Board. |
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4 |
TR1- |
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5 |
TR2+ |
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6 |
TR2- |
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7 |
TR3+ |
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8 |
TR3- |
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9 |
TR4+ |
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10 |
TR4- |
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|
11 |
GND |
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12 |
GND |
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13 |
GND |
Digital board provides Power to CM board, the power level range is; +12 to +24V DC | |
|
14 |
GND |
J2: Pin Definition (Preliminary)
|
J2 Pin |
CM Board |
Digital Board |
Comments |
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1 |
GND |
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2 |
Reset |
Digital board can send a reset signal to CM board, then to reset the CM. 0 ~ 3.3VDC | |
|
3 |
GPIO_01 |
0 ~ 3.3VDC | |
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4 |
GPIO_02 |
0 ~ 3.3VDC | |
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5 |
UART Enable |
0 ~ 3.3VDC | |
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6 |
UART Transmit |
0 ~ 3.3VDC | |
|
7 |
UART Receive |
0 ~ 3.3VDC | |
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8 |
GND |
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|
9 |
GND |
0 ~ 3.3VDC | |
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10 |
SPI MOSI |
0 ~ 3.3VDC | |
|
11 |
SPI CLOCK |
0 ~ 3.3VDC | |
|
12 |
SPI MISO |
0 ~ 3.3VDC | |
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13 |
SPI Chip Select 1 |
0 ~ 3.3VDC | |
|
14 |
GND |
Pin Header Matching with J1, J2: 2.0mm 2×7, Pin Header, Straight Angle, SMD
PCB Dimension
Product detail pictures:
Related Product Guide:
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