ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE

ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE

Short Description:

The MoreLink’s SA120IE is a DOCSIS 3.0 ECMM Module (Embedded Cable Modem Module) supporting up to 8 downstream and 4 upstream bonded channels to deliver a powerful high-speed Internet experience.

The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.


Product Detail

Product Tags

Product Detail

The MoreLink’s SA120IE is a DOCSIS 3.0 ECMM Module (Embedded Cable Modem Module) supporting up to 8 downstream and 4 upstream bonded channels to deliver a powerful high-speed Internet experience.

The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.

Base on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also can be used as a Spectrum Analyzer.

This product specification covers DOCSIS® and EuroDOCSIS® 3.0 versions of the Embedded Cable Modem Module series of products. Throughput this document, it will be referred as SA120IE.The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment. Based on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also it can be used as a Spectrum Analyzer (SSA-Splendidtel Spectrum Analyzer). Heatsink is mandatory and application specific. Three PCB holes are provided around the CPU, so that a heatsinking bracket or similar device can be affixed to the PCB, to transfer the generated heat away from the CPU and towards the housing and environment.

Product Features

➢ DOCSIS / EuroDOCSIS 3.0 compliant

➢ 8 downstream x 4 upstream bonded channels

➢ Support Full Band Capture

➢ Two MCX (Female) connectors for Downstream and Upstream

➢ Two 10/100/1000 Mbps Ethernet Ports

➢ Standalone External Watchdog

➢ Temperature sensor on board

➢ Accurate RF power level (+/-2dB) at all temperature range

➢ Embedded Spectrum Analyzer (Range: 5~1002 MHz)

➢ DOCSIS MIBs, SCTE HMS MIBs supported

➢ Software upgrade by HFC network

➢ Support SNMP V1/V2/V3

➢ Support baseline privacy encryption (BPI/BPI+)

➢ Small size (dimensions): 136mm x 54mm

Application

➢ Transponder: Fiber Node, UPS, Power Supply.

Technical Parameters

Protocol Support

DOCSIS/EuroDOCSIS 1.1/2.0/3.0
SNMP v1/v2/v3
TR069

CPU and Memory

CPU BCM33838M (8x4, Commercial, 0 ~ +70 oC)
BCM3383DI (8x4, Industrial, -40 ~ +85 oC)
Memory 64MB DDR3
Flash 8MB SPI Flash

Connectivity

RF: MCX1, MCX2 Two MCX Female, 75 OHM, Straight Angle, DIP
Ethernet Signal/PWR: J1, J2 1.27mm 2x17 PCB Stack, Straight Angle, SMD
2xGiga Ethernet Ports

RF Downstream

Frequency (edge-to-edge) 88~1002 MHz (DOCSIS)
108~1002 MHz (EuroDOCSIS)
Channel Bandwidth 6 MHz (DOCSIS)
8 MHz (EuroDOCSIS)
6/8 MHz (Auto Detection, Hybrid Mode)
Modulation 64QAM, 256QAM
Data Rate Up to 400 Mbps by 8 Channel bonding
Signal Level Docsis: -15 to +15 dBmV
Euro Docsis: -17 to +13 dBmV (64QAM); -13 to +17 dBmV (256QAM)

RF Upstream

Frequency Range 5~42 MHz (DOCSIS)
5~65 MHz (EuroDOCSIS)
5~85 MHz (Optional)
Modulation TDMA: QPSK,8QAM,16QAM,32QAM,64QAM
S-CDMA: QPSK,8QAM,16QAM,32QAM,64QAM,128QAM
Data Rate Up to 108 Mbps by 4 Channel Bonding
RF Output Level TDMA (32/64 QAM): +17 ~ +57 dBmV
TDMA (8/16 QAM):  +17 ~ +58 dBmV
TDMA (QPSK):      +17 ~ +61 dBmV
S-CDMA:           +17 ~ +56 dBmV

Networking

Network protocol IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 and L3)
Routing DNS / DHCP server / RIP I and II
Internet Sharing NAT / NAPT / DHCP server / DNS
SNMP version SNMP v1/v2/v3
DHCP server Built-in DHCP server to distribute IP address to CPE by CM’s Ethernet port
DCHP client CM automatically gets IP and DNS server address from MSO DHCP server

Mechanical

Dimensions 56mm (W) x 113mm (L)

Environmental

Power Input Support wide power input: +12V to +24V DC
Power Consumption 12W (Max.)
7W (TPY.)
Operating Temperature Commercial: 0 ~ +70 oC
Industrial: -40 ~ +85 oC
Operating Humidity 10~90% (Non Condensing)
Storage Temperature -40 ~ +85 oC

Board-to-Board Connectors between Digital and CM Board

There’re two boards: Digital board and CM Board, which use four pairs of board-to-board connectors to transmit RF signals, Digital signals and power.

Two pairs of MCX connectors used for DOCSIS Downstream and Upstream RF Signals. Two pairs of Pin Header/PCB Socket used for Digital Signals and Power. CM board is placed under the Digital Board. CM’s CPU is contacted to the housing through thermal pad to transfer the heat away from CPU and towards the housing and environment.

The mated height between two boards is 11.4+/-0.1mm.

Here’s the illustration of matched board-to-board connection:

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Note:

Cause of Board-to-Board design for two PCBA Boards, in order to make sure stable and reliable connection, therefore, when

To design the Housing, it should be taken the assembly engineering and screws for fix into consideration.

J1, J2: 2.0mm 2x7 PCB Socket, Straight Angle, SMD

J1: Pin Definition (Preliminary)

J1 Pin

CM Board
Female, PCB Socket

Digital Board
Male, Pin Header

Comments

1

GND

2

GND

3

TR1+

Giga Ethernet Signals from CM board.
There's NO Ethernet transformer on the CM board, here're Only the Ethernet MDI Signals to Digital Board. RJ45 and Ethernet transformer are placed at Digital Board.

4

TR1-

5

TR2+

6

TR2-

7

TR3+

8

TR3-

9

TR4+

10

TR4-

11

GND

12

GND

13

GND

Digital board provides Power to CM board, the power level range is; +12 to +24V DC

14

GND

J2: Pin Definition (Preliminary)

J2 Pin

CM Board
Female, PCB Socket

Digital Board
Male, Pin Header

Comments

1

GND

2

Reset

Digital board can send a reset signal to CM board, then to reset the CM. 0 ~ 3.3VDC

3

GPIO_01

0 ~ 3.3VDC

4

GPIO_02

0 ~ 3.3VDC

5

UART Enable

0 ~ 3.3VDC

6

UART Transmit

0 ~ 3.3VDC

7

UART Receive

0 ~ 3.3VDC

8

GND

9

GND

0 ~ 3.3VDC

10

SPI MOSI

0 ~ 3.3VDC

11

SPI CLOCK

0 ~ 3.3VDC

12

SPI MISO

0 ~ 3.3VDC

13

SPI Chip Select 1

0 ~ 3.3VDC

14

GND

1 (8)
1 (13)
1 (14)

Pin Header Matching with J1, J2: 2.0mm 2x7, Pin Header, Straight Angle, SMD

1 (9)
1 (13)
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PCB Dimension

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