Omg Factory – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink

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Our pursuit and company goal is to "Always satisfy our customer requirements". We continue to develop and design superior quality products for both our old and new customers and achieve a win-win prospect for our clients as well as us for Tv Modem, Docsis 3.0 Modem Spectrum, Eurodocsis Modem, Our company eagerly looks ahead to setting up long-term and pleasant small business partner associations with customers and businessmen from everywhere in the entire world.

Omg Factory – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink Detail:

Product Detail

The MoreLink’s SA120IE is a DOCSIS 3.0 ECMM Module (Embedded Cable Modem Module) supporting up to 8 downstream and 4 upstream bonded channels to deliver a powerful high-speed Internet experience.

The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.

Base on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also can be used as a Spectrum Analyzer.

This product specification covers DOCSIS® and EuroDOCSIS® 3.0 versions of the Embedded Cable Modem Module series of products. Throughput this document, it will be referred as SA120IE.The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment. Based on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also it can be used as a Spectrum Analyzer (SSA-Splendidtel Spectrum Analyzer). Heatsink is mandatory and application specific. Three PCB holes are provided around the CPU, so that a heatsinking bracket or similar device can be affixed to the PCB, to transfer the generated heat away from the CPU and towards the housing and environment.

Product Features

➢ DOCSIS / EuroDOCSIS 3.0 compliant

➢ 8 downstream x 4 upstream bonded channels

➢ Support Full Band Capture

➢ Two MCX (Female) connectors for Downstream and Upstream

➢ Two 10/100/1000 Mbps Ethernet Ports

➢ Standalone External Watchdog

➢ Temperature sensor on board

➢ Accurate RF power level (+/-2dB) at all temperature range

➢ Embedded Spectrum Analyzer (Range: 5~1002 MHz)

➢ DOCSIS MIBs, SCTE HMS MIBs supported

➢ Software upgrade by HFC network

➢ Support SNMP V1/V2/V3

➢ Support baseline privacy encryption (BPI/BPI+)

➢ Small size (dimensions): 136mm x 54mm

Application

➢ Transponder: Fiber Node, UPS, Power Supply.

Technical Parameters

Protocol Support
DOCSIS/EuroDOCSIS 1.1/2.0/3.0 SNMP v1/v2/v3 TR069
CPU and Memory
CPU	BCM33838M (8×4, Commercial, 0 ~ +70 ^oC) BCM3383DI (8×4, Industrial, -40 ~ +85 ^oC)
Memory	64MB DDR3
Flash	8MB SPI Flash
Connectivity
RF: MCX1, MCX2		Two MCX Female, 75 OHM, Straight Angle, DIP
Ethernet Signal/PWR: J1, J2		1.27mm 2×17 PCB Stack, Straight Angle, SMD 2xGiga Ethernet Ports
RF Downstream
Frequency (edge-to-edge)		88~1002 MHz (DOCSIS) 108~1002 MHz (EuroDOCSIS)
Channel Bandwidth		6 MHz (DOCSIS) 8 MHz (EuroDOCSIS) 6/8 MHz (Auto Detection, Hybrid Mode)
Modulation		64QAM, 256QAM
Data Rate		Up to 400 Mbps by 8 Channel bonding
Signal Level		Docsis: -15 to +15 dBmV Euro Docsis: -17 to +13 dBmV (64QAM); -13 to +17 dBmV (256QAM)
RF Upstream
Frequency Range		5~42 MHz (DOCSIS) 5~65 MHz (EuroDOCSIS) 5~85 MHz (Optional)
Modulation		TDMA: QPSK,8QAM,16QAM,32QAM,64QAM S-CDMA: QPSK,8QAM,16QAM,32QAM,64QAM,128QAM
Data Rate		Up to 108 Mbps by 4 Channel Bonding
RF Output Level		TDMA (32/64 QAM): +17 ~ +57 dBmV TDMA (8/16 QAM): +17 ~ +58 dBmV TDMA (QPSK): +17 ~ +61 dBmV S-CDMA: +17 ~ +56 dBmV
Networking
Network protocol		IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 and L3)
Routing		DNS / DHCP server / RIP I and II
Internet Sharing		NAT / NAPT / DHCP server / DNS
SNMP version		SNMP v1/v2/v3
DHCP server		Built-in DHCP server to distribute IP address to CPE by CM’s Ethernet port
DCHP client		CM automatically gets IP and DNS server address from MSO DHCP server
Mechanical
Dimensions		56mm (W) x 113mm (L)
Environmental
Power Input		Support wide power input: +12V to +24V DC
Power Consumption		12W (Max.) 7W (TPY.)
Operating Temperature		Commercial: 0 ~ +70 ^oC Industrial: -40 ~ +85 ^oC
Operating Humidity		10~90% (Non Condensing)
Storage Temperature		-40 ~ +85 ^oC

Board-to-Board Connectors between Digital and CM Board

There’re two boards: Digital board and CM Board, which use four pairs of board-to-board connectors to transmit RF signals, Digital signals and power.

Two pairs of MCX connectors used for DOCSIS Downstream and Upstream RF Signals. Two pairs of Pin Header/PCB Socket used for Digital Signals and Power. CM board is placed under the Digital Board. CM’s CPU is contacted to the housing through thermal pad to transfer the heat away from CPU and towards the housing and environment.

The mated height between two boards is 11.4+/-0.1mm.

Here’s the illustration of matched board-to-board connection:

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Note:

Cause of Board-to-Board design for two PCBA Boards, in order to make sure stable and reliable connection, therefore, when

To design the Housing, it should be taken the assembly engineering and screws for fix into consideration.

J1, J2: 2.0mm 2×7 PCB Socket, Straight Angle, SMD

J1: Pin Definition (Preliminary)

J1 Pin	CM Board Female, PCB Socket	Digital Board Male, Pin Header	Comments
1	GND
2	GND
3	TR1+		Giga Ethernet Signals from CM board. There’s NO Ethernet transformer on the CM board, here’re Only the Ethernet MDI Signals to Digital Board. RJ45 and Ethernet transformer are placed at Digital Board.
4	TR1-
5	TR2+
6	TR2-
7	TR3+
8	TR3-
9	TR4+
10	TR4-
11	GND
12	GND
13	GND		Digital board provides Power to CM board, the power level range is; +12 to +24V DC
14	GND

J2: Pin Definition (Preliminary)

J2 Pin	CM Board Female, PCB Socket	Digital Board Male, Pin Header	Comments
1	GND
2	Reset		Digital board can send a reset signal to CM board, then to reset the CM. 0 ~ 3.3VDC
3	GPIO_01		0 ~ 3.3VDC
4	GPIO_02		0 ~ 3.3VDC
5	UART Enable		0 ~ 3.3VDC
6	UART Transmit		0 ~ 3.3VDC
7	UART Receive		0 ~ 3.3VDC
8	GND
9	GND		0 ~ 3.3VDC
10	SPI MOSI		0 ~ 3.3VDC
11	SPI CLOCK		0 ~ 3.3VDC
12	SPI MISO		0 ~ 3.3VDC
13	SPI Chip Select 1		0 ~ 3.3VDC
14	GND

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Pin Header Matching with J1, J2: 2.0mm 2×7, Pin Header, Straight Angle, SMD

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PCB Dimension

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Product detail pictures:

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We emphasize enhancement and introduce new solutions into the market just about every year for Omg Factory – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink, The product will supply to all over the world, such as: Cairo, Vancouver, India, Item have passed by means of the national qualified certification and been well received in our main industry. Our expert engineering team will often be ready to serve you for consultation and feedback. We have been able to also deliver you with cost-free samples to meet your specs. Ideal efforts will probably be produced to deliver you the most beneficial service and solutions. Should really you be interested in our company and solutions, please make contact with us by sending us emails or call us straight away. To be able to know our solutions and enterprise. ar more, you'll be able to come to our factory to see it. We will constantly welcome guests from all over the world to our firm. o build business enterprise. elations with us. You should feel absolutely free to speak to us for organization. nd we believe we are going to share the best trading practical experience with all our merchants.

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We feel easy to cooperate with this company, the supplier is very responsible, thanks.There will be more in-depth cooperation.

By Meroy from Malta - 2017.02.28 14:19

We have been engaged in this industry for many years, we appreciate the work attitude and production capacity of the company, this is a reputable and professional manufacturer.

By Diana from Guyana - 2018.06.05 13:10